Method For Providing A One Piece Header Assembly Over Molded To An Implantable Medical Device
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United States of America Patent
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Issued Date -
Jan 19, 2006
app pub date -
Oct 3, 2005
filing date -
Feb 8, 2001
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
The present invention is directed to a header assembly attachable to a medical device for the purpose of connecting its output terminals to at least one lead, the lead terminating at a target organ or portion of the body intending to be assisted. A number of leads are connectable to the header, including single and coaxial leads. The header assembly may be molded directly to the medical device or performed and then attached to the device casing, either by mechanical fastener and/or chemical adhesive.
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