High thermal conductivity AIN-SiC composite artificial dielectric material
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United States of America Patent
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N/A
Issued Date -
Jan 19, 2006
app pub date -
Jul 15, 2004
filing date -
Jul 15, 2004
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
Dense composites of dielectric material having high thermal conductivity and adjustable dielectric properties. The dense composites are composed of homogeneous mixtures of AlN and SiC with at least one member selected from the group consisting of Y.sub.2O.sub.3, La.sub.2O.sub.3, rare earth oxides, CaO and Li.sub.2O. These composites are ideally shaped into usable products such as traveling wave tubes and electronic accelerators for use in microwave environments.
First Claim
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