Methods for forming substrates having a powder
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United States of America Patent
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app pub date -
Aug 16, 2005
filing date -
Jan 28, 2000
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Abstract
Methods for forming substrates having a powder are provided. The powder may be applied to the substrate by means of a rotating drum and a cooperating blade that dispenses the powder on to the substrate. The method may be used to dispense compositions for protecting plants, including, for example, fruits, vegetables, plants, and flowers, against decay. The method may include the application of an adhesive to the substrate into which the powder applied. The powder may be a mixture that includes at least one substance capable of adsorbing ethylene released by the plant, and at least one substance, an oxidizing agent, capable of degrading ethylene. The powder mixture may be in the form of individualized grains embedded in the adhesive layer. Part of the grain surface remains outside of the adhesive layer, for example, to thereby make the powder grains active in the degradation of ethylene.
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