Formation of a wire bond with enhanced pull
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United States of America Patent
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Issued Date -
Jan 19, 2006
app pub date -
Jul 13, 2004
filing date -
Jul 13, 2004
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A method of forming a wire connection using a bonding tool is provided. A first bond is first formed from a bonding wire fed from the bonding tool at a first bonding point. The bonding wire is then extended from the first bond while moving the bonding tool from the first bonding point towards a second bonding point. Thereafter, the bonding wire is mechanically deformed by contacting the bonding tool against a support surface and the bonding tool is moved in a direction away from the first bond to pull the bonding wire before forming a second bond with the bonding tool.
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