Sputtering magnetron control devices
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United States of America Patent
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Issued Date -
Jan 19, 2006
app pub date -
Jul 14, 2005
filing date -
Jul 16, 2004
priority date (Note) -
Abandoned
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Abstract
Embodiments relate to manipulating and controlling the magnetic field profile of a magnetron within a sputtering system dynamically (i.e., in real time), to most effectively utilize the target material as required by any stage of its erosion and to sputter deposit films with a desired profile or characteristics. In particular, embodiments relate to dynamic positional and rotational control of the magnetron or individual elements of the magnetron to alter the magnetic field profile of the magnetron during deposition.
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