Method and system for managing, analyzing and automating data in the production of semiconductor wafers and for monitoring the production process
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United States of America Patent
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Issued Date -
Jan 12, 2006
app pub date -
Jul 8, 2005
filing date -
Jul 9, 2004
priority date (Note) -
Abandoned
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Abstract
A system for integrating semiconductor wafer data for use in silicon manufacturing and device fabrication processes, the system including: a data acquisition system 00 capable of acquiring scan data from differing types of semiconductor wafer scanning tools such as wafer dimensional tools 10, wafer inspection tools 12, and wafer nanotopography tools 14, a buffer system 02 for providing temporary storage for scan data transmitted and for providing fault tolerance; a server system 04 for providing storage for the scan data transmitted from the buffer system 02 and for converting the scan data into a format used by and stored in a database 08 management system; and an analysis system 06, the analysis system 06 and the server system 04 providing wafer data management, process monitoring, wafer data analysis, and data automation.
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