Polyamic acids, polyimide films and polymide-metal laminates and methods for making same
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United States of America Patent
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Issued Date -
Jan 12, 2006
app pub date -
Jun 29, 2005
filing date -
Jul 9, 2004
priority date (Note) -
Abandoned
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Abstract
A polyamic acid obtained by the reaction of an aromatic diamine containing 1-100 mol percent of a carboxy-4,4'-diaminobiphenyl and an aromatic tetracarboxylic dianhydride or derivative thereof is provided. A polyimide is obtained from the imidization of the polyamic acid. Methods for obtaining the polyamic acid, the polyimide, a polyimide film, and a polyimide film-metal laminate are also disclosed. The polyimide film-metal laminate has a high peel strength of at least 10N/cm when laminated to a metal foil using an adhesive, and as such can generally be used as a flexible circuit substrate.
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