Thermoelectric heat dissipation device and method for fabricating the same
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United States of America Patent
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Issued Date -
Jan 12, 2006
app pub date -
Jul 6, 2004
filing date -
Jul 6, 2004
priority date (Note) -
Abandoned
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Abstract
A method for fabricating a thermoelectric heat dissipation device including the steps of providing a base plate, a thermoelectric semiconductive element connected to the base plate and a heat sink in form of plates or fins with one surface coated an electric insulation coating and patterned conductive lines, and adhering the heat sink to the thermoelectric semiconductive element. Accrodingly, the thermoelectric heat dissipation device is provided including the theremoelectric semiconductive element as a cryogenic chip and the heat sink. The cooling surface of the cryogenic chip is directly electrically connected to the heat sink which is in form of plates or fins, and the other surface of the cryogenic chip is adhered to the base plate. The base plate of the device is utilized to connect with the surface of an electronic component for heat transfer.
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