Apparatus and method for applying adhesive to a substrate

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20060003096A1
SERIAL NO

11173327

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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An apparatus for applying adhesive to a substrate (2) comprises a writing head (4) with a writing nozzle (5) and a camera (11). The writing head (4) can be moved in two horizontal directions so that it can write an adhesive pattern on the substrate (2). The position of the writing head (4) designated as the z height is controlled very accurately by means of a position measuring and control circuit (6) so that the tip of the writing nozzle (5) can be guided at a predetermined distance .DELTA.z.sub.0 above the substrate (2). In accordance with the invention, the apparatus is equipped with a triangulation measuring system with the aid of which the z height of the substrate (2) is determined and with a calibration device (15) for determining the relationship between the z position of the writing head (4) and the z height of the substrate (2).

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Patent Owner(s)

Patent OwnerAddress
UNAXIS INTERNATIONAL TRADING LTD6330 CHAM

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hartmann, Dominik Baar, CH 8 20
Scholze, Stephan Zurich, CH 8 8

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