Article for polishin substrate surface
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United States of America Patent
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N/A
Issued Date -
Dec 29, 2005
app pub date -
Jun 25, 2004
filing date -
Jun 25, 2004
priority date (Note) -
Abandoned
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Abstract
An article for polishing a surface of a semiconductor workpiece is provided. The article includes a polishing layer and a plurality of protrusions repeating across the polishing layer. The protrusions include abrasive particles and can be elastically deformed while polishing the surface of the wafer.
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