Method and apparatus for molding a semiconductor device
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United States of America Patent
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Jul 10, 2007
Grant Date -
Dec 29, 2005
app pub date -
Jun 25, 2004
filing date -
Jun 25, 2004
priority date (Note) -
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Abstract
A method and apparatus is provided for molding a semiconductor device in a mold including two mold halves. One mold half includes a compressible sealing mechanism constructed and configured to exert a sealing pressure between a surface of the mold half and a surface of a semiconductor device located in the mold. A compliant tape is positionable onto the mold half comprising the sealing mechanism between the semiconductor device and the sealing mechanism for molding of the semiconductor device.
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