Encapsulated device with heat isolating structure
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United States of America Patent
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Issued Date -
Dec 29, 2005
app pub date -
Nov 9, 2004
filing date -
Jun 23, 2004
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
The present invention provides an encapsulated device with heat isolating structure and a reflow soldering method thereof. The encapsulated device has a micro heat spreader with vapor chamber formed on the surface, and a cover covers the encapsulated device and wraps the micro heat spreader. A hermetical space is formed to isolate the high temperature when forming the solder balls and performing the SMT process, and prevent the micro heat spreader from being damaged. The present invention can provide an encapsulated device with heat isolating structure and a reflow soldering method thereof to protect the product in the reflow soldering process and improve the yield, and the cover can be reused to lower the cost.
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