Dielectric barrier discharge method for depositing film on substrates
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United States of America Patent
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app pub date -
Aug 24, 2005
filing date -
Aug 27, 2001
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Abstract
A method of coating at least one wafer with film. The method includes first flowing at least one purge gas and at least one reactant gas at least partially through an activation space of at least one electrode set. Next, placing a wafer beneath the activation space of the at least one electrode set. Finally, supplying AC power to at least one electrode set whereby a dielectric barrier is discharged at least partially within the activation space, from which the film descends onto the wafer.
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