Multiple device package
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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N/A
Issued Date -
Dec 22, 2005
app pub date -
Jun 21, 2004
filing date -
Jun 21, 2004
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A semiconductor package and method of assembling a semiconductor package is disclosed. The semiconductor package includes a first device mounted on a leadframe and a second device mounted on the leadframe. The leadframe has leads extending to the exterior of the package. An anvil may be used to mount a device on the package. The anvil may include two side portions to support the leads of the package, two end portions connected to the two side portions, and a cutout region.
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