Method for manufacturing a thin-layer component, in particular a thin-layer, high-pressure sensor, and thin-layer component
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United States of America Patent
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app pub date -
Jun 7, 2005
filing date -
Jul 26, 2000
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Abandoned
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Abstract
Proposed is a method for manufacturing a thin-layer component, in particular a thin-layer, high-pressure sensor, as well as a thin-layer component, where a resistive layer for forming measuring elements, in particular strain gauges, is deposited on an electrically non-conductive surface of a diaphragm layer, a contact-layer system for electrically contacting the measuring elements being deposited on the measuring elements in such a manner, that regions of the measuring elements are situated between each region of the contact-layer system and the diaphragm layer. This is used to provide, in particular, a high-pressure sensor, in which the capacitances of the contacts of the contact-layer system are designed to be symmetric.
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