Solidified granular material and high proof bending stress structure member and producing process thereof

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20050271871A1
SERIAL NO

11138401

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Abstract

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The high proof bending stress structure member of the present invention includes a thin wall frame structure member, a solidified granular material comprising a first granular material each of which is charged closely inside the thin wall frame structure member, such that one of the first granular material is in contact with another first granular material adjacent thereto, and a thermoplastic resin foam which fills the gap between each of the first granular material and which is welded to the surface of the first granular material whereby connecting the first granular material to each other, and the inner wall of the thin wall frame structure member with the first granular material.

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Patent Owner(s)

Patent OwnerAddress
HONDA MOTOR CO LTDTOKYO JAPAN TOKYO METROPOLIS
SEKISUI PLASTICS CO LTDOSAKA JAPAN OSAKA

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ashida, Naoyuki Amagasaki-shi, JP 1 1
Yamada, Kazumi Yasu-gun, JP 29 149
Yamazaki, Shouji Utsunomiya-shi, JP 10 124

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