Heat-dissipating structure inside the computer mainframe
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United States of America Patent
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Issued Date -
Dec 8, 2005
app pub date -
Jun 30, 2004
filing date -
Jun 4, 2004
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A heat-dissipating structure inside a computer mainframe comprising an air-guiding mask installed either to the side board of a mainframe case or above the heat dissipation module of CPU; when mainframe case is used together with different mother boards, the CPU location within the mother board is expected to change accordingly, but the air-guiding mask can be correlated effectively to the heat-dissipating holes on the mainframe case, cold air can be introduced into the mainframe to dissipate heat, hot air within the mainframe case can be prevented from back flowing into the heat-dissipating module installed above CPU, CPU temperature can therefore be lowered; meanwhile, when air-guiding mask is installed in the mainframe case, a baffle can be installed at the gap between the air-guiding mask and heat-dissipating module such that hot air back flow can be greatly reduced and cold air from exterior can cool CPU directly.
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