Chemical mechanical polishing pad and method for selective metal and barrier polishing
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Issued Date -
Dec 1, 2005
app pub date -
Oct 8, 2004
filing date -
Nov 29, 2000
priority date (Note) -
Abandoned
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Abstract
The present invention is directed, in general, to a polishing pad comprising a polishing body. The polishing body comprises a thermoplastic foam substrate having a surface comprising concave cells. The thermoplastic foam substrate comprises a blend of cross-linked ethylene vinyl acetate copolymer and polyethylene. The thermoplastic foam substrate has a hardness ranging from about 24 Shore A to about 100 Shore A. Other embodiments include a method for preparing the polishing pad, a polishing apparatus that includes the polishing pad, and a method of polishing a semiconductor substrate using the polishing pad.
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