Semiconductor molding method and structure
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
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N/A
Issued Date -
Nov 24, 2005
app pub date -
May 18, 2004
filing date -
May 18, 2004
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A semiconductor molding method and structure, wherein a chip carrier is mounted with a plurality of semiconductor chips thereon, and encapsulation bodies are fabricated on the chip carrier to form a plurality of package units for respectively encapsulating the semiconductor chips. At least one pair of adjacent package units are connected together by at least one connective portion made of the encapsulation body, so as to prevent the semiconductor molding structure from warpage and deformation.
First Claim
all claims..Other Claims data not available
Family
- No Family data available.
- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
ULTRATERA CORPORATION | NO 2 LI-HSIN RD 3 SCIENCE-BASED INDUSTRIAL PARK HSINCHU |
International Classification(s)

- 2004 Application Filing Year
- H01L Class
- 14681 Applications Filed
- 9246 Patents Issued To-Date
- 62.98 % Issued To-Date
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Kim, Sung Jin | Hsin-Chu, TW | 350 | 2734 |
# of filed Patents : 350 Total Citations : 2734 |
Cited Art Landscape
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Patent Citation Ranking
- 2 Citation Count
- H01L Class
- 2.00 % this patent is cited more than
- 20 Age
Forward Cite Landscape
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Maintenance Fees
Fee | Large entity fee | small entity fee | micro entity fee | due date |
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Fee | Large entity fee | small entity fee | micro entity fee |
---|---|---|---|
Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
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