Method and apparatus for forming nitrided silicon film

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United States of America Patent

SERIAL NO

10520815

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A method for forming a silicon nitride film which comprises heating a substrate (2) placed in the inner space (3) of a chamber (4) to a desired temperature, feeding a hexamethyl disilazane gas and a gas containing active species formed by the plasma excitation of an N.sub.2 gas to the chamber (4) holding the substrate (2), to thereby deposit a reaction product formed by the reaction of the hexaalkyldisilazan gas with the above active species and form the silicon nitride film. The method allows the formation of a silicon nitride film being reduced in the contents of carbon and hydrogen with safety and good efficiency.

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Patent Owner(s)

Patent OwnerAddress
KANSAI TECHNOLOGY LICENSING ORGANIZATION CO LTD93 CHUDOJI AWATA-CHO SHIMOGYO-KU KYOTO-SHI KYOTO 600-8815
SAKIGAKE-SEMICONDUCTOR CORPORATION584-1 NAKAMIKADOYOKO-CHO SAWARAGICHODORIKUROMONHIGASHIIRU KAMIGYO-KU KYOTO-SHI KYOTO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Taguchi, Kohshi Kyoto, JP 2 10
Yoshimoto, Masahiro Kyoto, JP 44 139

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