Air conditioning heat dissipation system
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United States of America Patent
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N/A
Issued Date -
Nov 17, 2005
app pub date -
May 12, 2004
filing date -
May 12, 2004
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
An air-conditioning heat dissipation system includes a heat dissipation device and an enclosure. The heat dissipation device has a top and a bottom heat sinks secured to each other and a cryogenic chip sandwiched between the top and bottom heat sinks. The enclosure has a box assembly and a planar assembly extending from one side of the box assembly. The box assembly is operative to receive the heat dissipation device therein, and the planar assembly includes a channel having one end in communication with the box assembly and the other end open to external.
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