Package design and method for electrically connecting die to package
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United States of America Patent
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N/A
Issued Date -
Nov 17, 2005
app pub date -
May 12, 2004
filing date -
May 12, 2004
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A method and apparatus for electrically connecting a die to a package while reducing the length of wirebonds. This in turn reduces wire-sweep and the cost of manufacture. To reduce the length of the wirebonds, bonding holes are created through an insulating layer of the package to expose a conductive layer. A wirebond connects through the bonding hole to a conductive layer that is exposed by the hole. The attachment point for the wirebond on the conductive layer may be prepared to serve as a bonding pad. Using this technique the prior art method utilized a bonding pad on the top surface of the inner surface of the package, which electrically connects through a trace to a via, which in turn electrically connects to a conductive layer may be avoided thereby allowing for closer spacing of radially concentric rows of attachment points on the package around the die.
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