Sputtering device
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United States of America Patent
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Issued Date -
Nov 17, 2005
app pub date -
May 10, 2005
filing date -
May 11, 2004
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
The object of the invention is to provide a sputtering device which can design uniformity of film thickness distribution by corresponding to ablation change of a target and can gain a stable film quality by uniformity of film growth components. Accordingly, a sputtering device according to this invention comprises at least: a vacuum container defining a vacuum space; a substrate holder for holding a substrate in said vacuum container; at least one sputtering cathode device which is provided with a cathode unit located at a position facing said substrate held on the substrate holder and arranged slantly at a specific angle to said substrate, and a means for moving cathode unit in parallel along said substrate; and a target installed on said cathode unit. The plural sputtering cathode devices can be also arranged at specific intervals in a circumferential direction of the substrate holder.
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