Electronic device with high lead density
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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N/A
Issued Date -
Nov 10, 2005
app pub date -
May 5, 2004
filing date -
May 5, 2004
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
An electronic device moldable to form a leadless electronic package and a method of forming the electronic device are provided. The electronic device comprises a die pad adapted for attachment of a die and a frame surrounding the die pad. A plurality of leads extend from the frame towards the die pad such that each lead has a bonding site on a top surface thereof configured for attachment of a bonding wire. The said leads include a first set of leads having bonding sites located substantially on a first plane and a second set of leads having bonding sites located substantially on a second plane that is parallel to but spaced from the first plane.
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