Head stack assembly and manufacturing thereof
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United States of America Patent
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N/A
Issued Date -
Nov 3, 2005
app pub date -
Apr 28, 2004
filing date -
Apr 28, 2004
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A method for manufacturing a head stack assembly (HSA) of a disk drive unit includes including the steps of: forming a head arm assembly (HAA) having an overmolded suspension flexure cable thereon and a flexible printed circuit assembly; and bonding the suspension flexure cable with the flexible printed circuit assembly by conductive epoxy to attain an electrical connection therebetween. In the invention, the conductive epoxy is preferably anisotropic conductive film. Forming the head arm assembly further comprises forming a drive arm, and overmolding a suspension, a bracket, and a voice coil thereonto. Also, the method may further include a step of forming another HAA as a part of the HSA. In addition, a structure of the HSA is also disclosed in the present invention.
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