Adhesion improvement for low k dielectrics to conductive materials
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United States of America Patent
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Issued Date -
Oct 20, 2005
app pub date -
Apr 19, 2004
filing date -
Apr 19, 2004
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Abstract
Methods are provided for processing a substrate for depositing an adhesion layer between a conductive material and a dielectric layer. In one aspect, the invention provides a method for processing a substrate including positioning a substrate having a conductive material disposed thereon, introducing a reducing compound or a silicon based compound, exposing the conductive material to the reducing compound or the silicon based compound, and depositing a silicon carbide layer without breaking vacuum.
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