Position sensor provided in the form of a hall-effect sensor
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United States of America Patent
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Issued Date -
Oct 20, 2005
app pub date -
Dec 1, 2004
filing date -
Jul 13, 2002
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A position sensor designed in the form of a Hall sensor with an elongated circuit substrate (32) in the form of a molded interconnect device (MID) which includes an elongated support element consisting of injection molded plastic material, which at its front end side (37) has a support face (36), which is so fitted with a sensor element constituted by a Hall plate (27) or comprising a Hall plate (27) that the plane of the Hall plate (27) is perpendicular to the longitudinal axis of the circuit substrate (32). The sensor element (26) is electrically contacted by means of printed wiring (35), such printed wiring being constituted by a structured metal layer applied to the support element (34).
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