Cathode substrate and its manufacturing method
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United States of America Patent
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Issued Date -
Oct 20, 2005
app pub date -
Feb 28, 2005
filing date -
Mar 1, 2004
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A cathode substrate according to the present invention comprises a cathode electrode layer(12), insulator layer(14) and gate electrode layer(15) formed sequentially on a substrate to be processed (11). The insulator layer includes a hole (14a) formed there through. A gate aperture (16) is formed through the gate electrode layer. An emitter (E) is then provided at the bottom of the hole (14a). In this case, the gate aperture comprises a plurality of openings (16a), the total area of which is smaller than the area of top opening of the hole in the insulator layer. The openings are arranged densely at a position opposite to the emitter and just above the hole of the insulator layer.
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