Support fixture for semiconductor wafers and associated fabrication method
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United States of America Patent
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N/A
Issued Date -
Oct 20, 2005
app pub date -
Apr 16, 2004
filing date -
Apr 16, 2004
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A support fixture is provided that includes a boat, a first layer deposited on at least a portion of the boat that has fewer impurities than the boat, and a second layer deposited on at least a portion of the first layer that is formed of a material having one or both of a hardness and a coefficient of thermal expansion that more closely matches the material properties of the wafers to be carried by the support fixture than does those of the boat and the first layer. For example, the boat and the first layer may be formed of silicon carbide and the second layer may be formed of polysilicon. A method of fabricating a support fixture having a boat coated with first and second layers, such as by sequential chemical vapor deposition steps, is also provided.
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