Lead frame having a tilt flap for locking molding compound and semiconductor device having the same
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Oct 13, 2005
app pub date -
Apr 1, 2004
filing date -
Apr 1, 2004
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
To enhance the adhesion force between a lead frame and a molding compound of a surface mount semiconductor device, a lead frame having two opposite sides, with at least one tilt flap for locking a molding compound extending from one side and a reduced portion of the lead frame extending from the opposite side, and a surface mount semiconductor device having the same, are disclosed. The at least one tilt flap and the reduced portion are formed on the lead frame such that the adhesion force between the lead frame and the molding compound is enhanced.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully