Power coupling for high-power sputtering
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United States of America Patent
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Issued Date -
Oct 13, 2005
app pub date -
Apr 8, 2004
filing date -
Apr 8, 2004
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A system and method for coating a substrate is described. One embodiment includes a high-power sputtering system with a power coupler configured to deliver power to a rotatable target. The power coupler is positioned in a vacuum chamber or between the bearings and the rotatable target outside the vacuum chamber to limit the current that flows through the bearing.
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