Top finger having a groove and semiconductor device having the same
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United States of America Patent
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N/A
Issued Date -
Oct 6, 2005
app pub date -
Apr 1, 2004
filing date -
Apr 1, 2004
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
To provide a robust soldering process for a top finger of a surface mount device, a lead frame having a top finger and a semiconductor device having the same are disclosed, wherein the top finger comprises a groove and the groove is provided at the bottom surface of the top finger that establishes contact with a die and adjacent to the contact position between the top finger and die so as to prevent solder from overflowing onto a chip passivation ring, reducing the stress on the die and increasing the reliability.
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