Chemical-mechanical planarization composition having PVNO and associated method for use
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United States of America Patent
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app pub date -
Apr 8, 2005
filing date -
Oct 10, 2003
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Abandoned
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Abstract
A composition and associated method for chemical mechanical planarization (or other polishing) are described. The composition contains an abrasive, a dielectric protector comprising a polyvinylpyridine-N-oxide polymer, an oxiding agent, and water. The composition affords minimization of local erosion effects and possesses high selectivities for metal and barrier material removal in relation to dielectric layer materials in metal CMP. The composition is particularly useful in conjunction with the associated method for metal CMP applications (e.g., step 1 copper CMP processes and step 2 copper CMP processes).
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