Method and apparatus for package testing
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United States of America Patent
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Issued Date -
Sep 29, 2005
app pub date -
Mar 26, 2004
filing date -
Mar 26, 2004
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A method and apparatus for testing a package design and material set comprising using a test die to form a test device and subjecting the test device to a test procedure, such as a highly accelerated stress test (HAST). In one embodiment the device, which comprises a die and a package to be tested, is constructed using a test die. The test die comprises a non-functional die having one or more conductive traces thereon. Use of a test die reduces costs as compared to a functional die and reduces the time to market by allowing package testing prior to creation and testing of a functional die. In one embodiment the test die is configure with conductive traces on its top surface to allow for biasing before, during, or after testing.
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