Method of creating multi-layered monolithic circuit structure containing integral buried and trimmed components
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United States of America Patent
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Issued Date -
Sep 22, 2005
app pub date -
Mar 17, 2004
filing date -
Mar 17, 2004
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Abandoned
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Abstract
A method of creating a multi-layered monolithic circuit structure wherein individual layers of standard alumina thick film ceramic substrate and the resistors, inductors, capacitors, and other circuit componentry printed thereon are fired, and the circuit componentry trimmed or otherwise adjusted to achieve a desired degree of precision prior to combining the layers with a thick film glass bonding agent to form the monolithic structure.
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