METHOD FOR FABRICATING METALLIC STRUCTURE
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United States of America Patent
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N/A
Issued Date -
Sep 22, 2005
app pub date -
Mar 19, 2004
filing date -
Mar 19, 2004
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
First, a substrate is provided and a photoresist layer is coated thereon. Then, a film having a pattern is used as a mask to perform an exposing and developing process for patterning the photoresist layer. Following that, LIGA technology is employed to form a thin film having a pattern corresponding to the pattern of the film.
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