Rails for semiconductor wafer carriers
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United States of America Patent
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N/A
Issued Date -
Sep 22, 2005
app pub date -
Mar 18, 2004
filing date -
Mar 18, 2004
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A rail is provided for use as a support in an apparatus for holding a plurality of semiconductor wafers. The rail has a plurality of teeth arranged in a vertical column, such that the space between a top surface of one tooth and a bottom surface of the next higher adjacent tooth forms a slot for receiving a portion of a semiconductor wafer. A support structure for supporting the wafer is located on the top surface of substantially all teeth that form the bottom of a slot, the support structure having sidewalls and an upper surface spaced from the top surface. On each support structure, a radius is formed at each intersection of the sidewalls and the upper surface. The support structure extends for at least approximately 50% of the length of each tooth.
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