Importance

Loading Importance Indicators...

Abstract

The present invention is to provide a sputtering device in which a film can be formed to a large sized substrate efficiently and uniformity of forming film distribution is designed, which comprises a sputtering cathode group including a plurality of sputtering cathodes which are established at a specific arrangement in a direction perpendicular to a movable direction of a large sized substrate which moves in a specific direction. Note that it is preferred that the sputtering cathode is a round shape. It is preferred that the sputtering cathode group is a first sputtering cathode row comprising a plurality of sputtering cathodes which are arranged at specific intervals in the direction perpendicular to the movable direction of the large sized substrate. It is preferred that the sputtering cathode group has a second sputtering cathode row comprising a plurality of sputtering cathodes which are arranged at a specific distance to the first sputtering cathode row in the movable direction and which are arranged at positions where every sputtering cathodes in the first sputtering cathode row are not overlapped against the movable direction. It is preferred that centers of the sputtering cathodes constituting the first sputtering cathode row and centers of the sputtering cathodes constituting the second sputtering cathode row are positioned at regular intervals alternately when they are projected in the movable direction.

Loading the Abstract Image...

First Claim