Thermosetting resin compositions, resin films and film articles
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United States of America Patent
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Issued Date -
Sep 8, 2005
app pub date -
Mar 1, 2005
filing date -
Mar 2, 2004
priority date (Note) -
Abandoned
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Abstract
An object of the present invention is to provide a thermosetting resin composition having a low dielectric constant, a low dielectric loss tangent, a low thermal expansion coefficient and an excellent peel strength at a low surface roughness after roughening adapted to additive process. The present invention provides a thermosetting resin composition comprising (a) 100 weight parts of polyfunctional vinyl benzyl ether compound, (b) 1 to 100 weight parts of solvent soluble polyimide resin, and (c) 0.01 to 10 weight parts of a catalyst for thermosetting reaction.
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