Integrated circuit package with keep-out zone overlapping undercut zone
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United States of America Patent
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Issued Date -
Sep 8, 2005
app pub date -
Mar 3, 2004
filing date -
Mar 3, 2004
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
An integrated circuit package is provided with a connective structure having a wire bonding zone and a keep-out zone. An integrated circuit die has an undercut defining an undercut zone, which is overlapped by the keep-out zone. A wire is bonded between the integrated circuit die and the connective structure within the wire bonding zone and outside of the keep-out zone.
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