Modular semiconductor workpiece processing tool
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United States of America Patent
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app pub date -
Apr 7, 2005
filing date -
Jul 15, 1996
priority date (Note) -
Abandoned
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Abstract
The present invention provides for a semiconductor workpiece processing tool and methods for handling semiconductor workpiece therein. The semiconductor workpiece processing tool preferably includes an interface section comprising at least one interface module and a processing section comprising a plurality of processing modules for processing the semiconductor workpieces. The semiconductor workpiece processing tool may have a conveyor for transferring the semiconductor workpieces between the interface modules and the processing modules.
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