Semiconductor device support structures
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United States of America Patent
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N/A
Issued Date -
Sep 1, 2005
app pub date -
Jan 31, 2005
filing date -
Jan 29, 2004
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A semiconductor device is provided that includes a platform having an interior surface and an exterior conductive surface. The exterior conductive surface includes an indentation or notch in a portion of one or more edges. The device also includes a die that electrically couples to the interior surface of the platform, along with one or more clips that couple a conductive area of the die to one or more conductive leads. A package enclosure encapsulates the interior surface of the platform, the die, the clip, and portions of the conductive lead. The package enclosure engages the indentation in the exterior conductive surface and secures the package enclosure to the platform.
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