Method and apparatus for scrap removal from rotary dies
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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N/A
Issued Date -
Sep 1, 2005
app pub date -
Jul 30, 2003
filing date -
Dec 28, 2000
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
An improved rotary die cutting apparatus and method for removing scrap material from work pieces such as paperboard blanks. One of the dies of a pair of rotary cutting dies is provided with gripper elements that extend over at least a portion of the area of the die corresponding to the areas over which the scrap portions are generated. The gripper elements grip, without piercing completely through, the scrap portions generated by the cutting operation of the dies. A stripping knife extends across the die carrying the scrap portions at a height above the gripper elements that provides clearance between the gripper elements and the stripping knife but contacts the scrap portions retained on the gripper elements.
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