Separator for electronic component and method for producing the same
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United States of America Patent
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Issued Date -
Aug 25, 2005
app pub date -
Feb 23, 2005
filing date -
Feb 24, 2004
priority date (Note) -
Abandoned
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Abstract
The present invention provides an electronic component separator that allows for easy thickness reduction and also has excellent mechanical strength, dimensional stability and heat resistance. This electronic component separator contains in a porous film made of a synthetic resin with a glass transition temperature of 180.degree. C. or above, filler grains having a melting point of 180.degree. C. or above or virtually no melting point, and the electronic component separator is produced by way of applying onto a base a coating material comprising (a) a synthetic resin with a glass transition temperature of 180.degree. C. or above, (b) filler grains having a melting point of 180.degree. C. or above or virtually no melting point, (c) at least one good solvent capable of dissolving the synthetic resin, and (d) at least one poor solvent incapable of dissolving the synthetic resin, and then drying the coated base to form a porous film.
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