Irregular shaped copper particles and methods of use
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Issued Date -
Aug 18, 2005
app pub date -
Jan 3, 2005
filing date -
Dec 15, 2000
priority date (Note) -
Abandoned
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Abstract
The present invention provides water atomized copper powder comprising substantially irregular shaped copper particles having at least a median D.sub.50 particle size of from about 20 .mu.m or greater to about 50 .mu.m. The powders of the present invention are suitable for use in electrically conductive compositions, such as copper-based adhesives. The present invention also provides methods of making these copper powders.
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