Thermosetting resin compositions and film articles
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United States of America Patent
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Issued Date -
Aug 18, 2005
app pub date -
Jan 21, 2005
filing date -
Feb 2, 2004
priority date (Note) -
Abandoned
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Abstract
A thermosetting resin composition comprises (a) epoxy resin, (b) setting agents comprising a novolak-type phenol resin and a benzooxazine compound and (c) a siloxane-modified polyamide-imide resin satisfying the following relationship. 0.6.ltoreq.m+n.ltoreq.2, 0.5.ltoreq.m.ltoreq.1.2, and 0.1.ltoreq.n.ltoreq.1.0 ('m' represents the hydroxyl group equivalent of (b) said novolak-type phenol resin with respect to the epoxy equivalent of (a) said epoxy resin of 1, and 'n' represents the hydroxyl group equivalent of (b) the benzooxazine compound after thermal decomposition with respect to the epoxy equivalent of (a) the epoxy resin of 1. The thermosetting resin composition comprises (c) the siloxane-modified polyamide-imide resin in a content of 2 to 50 weight parts with respect to the total content of (a) the epoxy resin and (b) the setting agents of 100 weight parts.
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