Metal/ceramic bonding member and method for producing same
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United States of America Patent
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Issued Date -
Aug 11, 2005
app pub date -
Jan 28, 2005
filing date -
Feb 6, 2004
priority date (Note) -
Abandoned
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Abstract
In a method for producing a metal/ceramic bonding member wherein an electroless nickel alloy plating layer 18 is formed on a predetermined portion of the surface of an aluminum plate 12 which is bonded to at least one side of a ceramic substrate 10 and which is formed so as to have a predetermined circuit pattern, an alkali peeling type resist 16 having a predetermined shape is applied on the surface of the aluminum plate 12 before forming the electroless nickel alloy plating layer 18, and then, a portion of the surface of the aluminum plate 12, on which the resist 16 is not applied, is activated with an acidic zinc immersion solution containing a fluoride or silicofluoride. Then, after the electroless nickel alloy plating layer 18 is formed, the resist 16 is removed with an alkali.
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