Microsystem enclosure and method of hermetic sealing

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20050173812A1
SERIAL NO

10774926

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A microsystem enclosure for hermetically sealing and thereby protecting a microsystem located on a substrate from the potentially damaging effects of exposure to moisture, dust, and other external environmental or operating conditions. The enclosure broadly comprises a single-piece hermetic cover structure and a single solder preform. The preform facilitates sealing the cover to the substrate in high-temperature, single-step process so as to create a hermetic cavity wherein the microsystem resides.

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Patent Owner(s)

Patent OwnerAddress
HONEYWELLPO BOX 419159 KANSAS CITY MO 64141-6159

International Classification(s)

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  • 2004 Application Filing Year
  • H01L Class
  • 14681 Applications Filed
  • 9246 Patents Issued To-Date
  • 62.98 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances2004200520062007200820092010201120122013201420152016201720182019202020210255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Blazek, Roy J Overland Park, KS 6 10
Kautz, David Lenexa, KS 7 10
Morgenstern, Howard Lee's Summit, MO 5 10

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  • 2 Citation Count
  • H01L Class
  • 2.00 % this patent is cited more than
  • 20 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges56113063435821410785533224218401 - 1011 - 2021 - 3031 - 4041 - 5051 - 6061 - 7071 - 8081 - 9091 - 100100 +05010015020025030035040045050055060065070075080085090095010001050110011501200

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