Packaging structure and component installation method for oscillator
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United States of America Patent
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Issued Date -
Aug 11, 2005
app pub date -
May 7, 2004
filing date -
Feb 6, 2004
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
Disclosed are a packaging structure of an oscillator and a method for installing components in the packaging structure. Fluid capillarity and surface tension are utilized so that both the dimension of the oscillator can be reduced and the contamination of the piezoelectric components of the oscillator can be avoided at the same time. The packaging structure includes a platform having a top surface and a bottom surface, a number of side rims on the circumstance of the top surface extending upward for a distance and forming a top-open space with the top surface that can receive at least a piezoelectric component; a top cover sealing the top-open space into a closed and airtight space; a circuit placed beneath the bottom surface that can attach at least an electronic component, a number of pillars of a same length positioned on the circuit; a bottom cover having an adhesive injection aperture and joining the pillars to form a partially open space, and a malleable material filling the partially open space through the aperture.
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