Dies bonding apparatus and dies bonding method

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20050172891A1
SERIAL NO

10892133

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

A dies bonding apparatus is provided with a nozzle unit for supplying an adhesive agent to a rectangular bonding area of a chip mounting surface. The nozzle unit includes a central nozzle for discharging an adhesive agent to the center of the bonding area, and a plurality of peripheral nozzles provided around the central nozzle and whose amount of discharge of the adhesive agent is smaller than the amount of discharge of the adhesive agent from the central nozzle.

First Claim

See full text

Other Claims data not available

Family

Loading Family data... loading....

Patent Owner(s)

Patent OwnerAddress
OKI ELECTRIC INDUSTRY CO LTD1-7-12 TORANOMON MINATO-KU TOKYO 105-8460

International Classification(s)

loading....
  • 2004 Application Filing Year
  • B05C Class
  • 384 Applications Filed
  • 119 Patents Issued To-Date
  • 30.99 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances200420052006200720082009201020112012201320140255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Muraki, Shinji Tokyo, JP 3 26
Suzuki, Shinsuke Miyazaki, JP 43 673

Cited Art Landscape

Load Citation

Patent Citation Ranking

  • 21 Citation Count
  • B05C Class
  • 89.82 % this patent is cited more than
  • 20 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges121415011542101 - 1011 - 2021 - 3031 - 4041 - 5051 - 6061 - 700102030405060708090100110120130140150

Forward Cite Landscape

Load Citation